Programmable vacuum reflow soldering and brazing oven with heating area 260x210mm.


Positive pressure
Heating position
Gas supply control
Formic acid compartment
Additional gas line
Pressure measurement
Independent overheat protection
Signal indication
Clearance above heating plate
Vacuum valve
Power supply (required field)
Vacuum pump

Product code: VSU28


Infrared lamps placed under (or optionally, also above) the tooling plate heat it up. The tooling plate in a rectangle form with dimensions 260x210mm can be produced of any suitable material also with custom openings for fixtures inside it. Design enables loading of tooling plate inside the chamber together with the parts on it - suitable for serial production.

Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate. The chamber itself is water cooled. External water chiller is required, if not ordered with mounting rack MR23CP.



Process environment nitrogen, inert gas, formic acid, forming gas
Maximum temperature 650°C
Heating area 260 x 210 mm
Heating plate removable: graphite, aluminum, etc.
Clearance above heating plate 50mm with single / 60mm with double heating
Heat up / cool down ramp 250°C/min
Control deviation +/- 0.5°C
Heating elements 8x/16x infrared heating lamps in one or two rows
Heating control individual/adjustable on every heating lamp
Cooling of heating plate nitrogen flow
Temperature measurement up to 4x thermocouples K-Type freely positional
Pressure measurement integrated pressure transmitter
Maximum vacuum 5x10-2 mbar
Formic acid bubbler optional
Cooling of chamber body water/ethylene glycol mixture
Lid viewing port 80 mm / not available with double heating
Display 10" LCD with touch screen
PC Software process logging, recipe transfer, etc.
User interface remote control over relay I/Os
Dimensions see layout
Weight 125 kg (with all options included)
Power supply 3 phase, country specific


Compact design
Compact design
Easy maintenance
Easy maintenance
Smart thermo regulator
Smart thermo regulator
Formic acid bubbler
Formic acid bubbler
Dual infrared heating
Dual infrared heating
Additional lamps cooling
Additional lamps cooling
Positive pressure
Positive pressure


Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors and high energy batteries, etc.

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