VSU28

Programmable vacuum reflow soldering and brazing oven with heating area 260x210mm.

Configuration

Positive pressure
Heating position
Formic acid bubbler
Additional gas line
Pressure measurement
Independent overheat protection
Signal indication
Clearance above heating plate
Power supply (required field)
Mounting rack
Vacuum pump

Product code: VSU28

Product price: USD 41178

Delivery time:

Overview

Infrared lamps placed under (or optionally, also above) the tooling plate heat it up. The tooling plate in a rectangle form with dimensions 260x210mm can be produced of any suitable material also with custom openings for fixtures inside it. Design enables loading of tooling plate inside the chamber together with the parts on it - suitable for serial production.

Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate. The chamber itself is water cooled. External water chiller is required, if not ordered with mounting rack MR23CP.

Datasheets

Specifications

Maximum temperature 650°C
Heated area 260 x 210 mm
Clearance above heater plate 50 mm
Ramp heat up / cool down 250°C/min
Control deviation +/- 0.5°C
Heating / cooling type infrared heating / nitrogen flow
Temperature measurement up to 4x thermocouples K-Type freely positional
Pressure measurement integrated pressure transmitter
Maximum vacuum 5x10-4 mbar
Formic acid bubbler 40 ml container, integrated in front panel
Chamber cooling water cooling / external chiller is required
Display 7" LCD with touch screen
Dimensions 550 mm(W) x 615 mm(D) x 400 mm(H) with closed lid
Weight 42 kg (55 kg with pressure option)
Power supply 3 phase / 190-240V, 50/60 Hz

Highlights

Compact design
Compact design
Easy maintenance
Easy maintenance
Smart thermo regulator
Smart thermo regulator
Formic acid bubbler
Formic acid bubbler
Dual infrared heating
Dual infrared heating
Additional lamps cooling
Additional lamps cooling
Positive pressure
Positive pressure

Applications

Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors, etc.

INVACU Ltd.


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