Hello Nuremberg! We are at the SMT Hybrid Packaging 2018 at stand 4-122. Come over for a visit!
Hallo Nürnberg! Wir sind auf der SMT Hybrid Packaging 2018 an Stand 4-122. Besuchen Sie uns!
Posted on 2017-12-19
During our latest test of vacuum reflow solder unit VSU28-D we measured heating rates of up to 996 K/minute. We ran this test without software limitation on the ramp speed and in maximum power. In 118 seconds the chamber reached 800°C. The experiment is made in 100mbar vacuum with the standard blank graphite plate 260x210x4.5mm and 230V supply. This power test shows that the dual heating VSU28 can be used for rapid thermal annealing of substrates or in any other cases where fast heating is required.
Posted on 2017-03-29
We announced our first vacuum reflow oven with control over the oxygen concentration. System is equipped with external oxygen analyzer that communicates with the standard user interface of VSU28 enabling stop and hold the reflow process until certain low concentration in the chamber is reached. Thus the reflow process can be run under guaranteed low levels of oxygen down to in ppm range resulting in excellent wetting between solder surfaces.
Posted on 2017-03-01
Invacu introduces vacuum soldering system based on VSU28 model with double heating capable to pressurize the chamber up to 4.5 bar absolute. The powerful heating enables fast ramps even with very heavy thermal load. The heating distributes the power and creates an unique temperature uniformity when placed on the bottom of the chamber and in the lid. 70mm clearance over the heating plate allows processing of higher substrates and fixtures. Positive pressure combined with vacuum gives the possibility of super void removal even when the solder area is extremely large. Air flow through the heating lamps also in the lid assists the chamber cooling process lowering the nitrogen consumption.
Posted on 2017-01-31