Programmable vacuum reflow soldering and brazing oven with heating area 420x420mm.


Positive pressure
Heating position
Gas supply control
Formic acid compartment
Additional gas line
Pressure measurement
Independent overheat protection
Signal indication
Vacuum valve
High vacuum
Power supply (required field)
Vacuum pump

Product code: VSU45


Infrared lamps are placed crossed under the tooling plate and in the lid. Tooling plate in a square form with dimensions 420x420mm can be produced of any suitable material also with custom openings for fixtures inside it. Design enables loading of tooling plate inside the chamber together with the parts on it - suitable for serial production.

Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate.



Process environment nitrogen, inert gas, formic acid, forming gas
Maximum temperature 450°C
Heating area 420 x 420 mm
Heating plate removable: graphite, aluminum, etc.
Clearance above heating plate 60mm (85mm between bottom and top heaters)
Heat up / cool down ramp 250°C/min
Control deviation +/- 0.5°C
Heating elements 16x infrared heating lamps in two crossed rows
Heating control individual/adjustable on every heating lamp
Cooling of heating plate nitrogen flow
Temperature measurement up to 4x thermocouples K-Type freely positional
Pressure measurement full range over two gauges
Maximum vacuum 1x10-2 mbar (5x10-6 mbar with turbo pump)
Formic acid bubbler 40 ml container in front panel with auto refill
Cooling of chamber body water/ethylene glycol mixture
Lid viewing port 80 mm with shutter
Display 10" LCD with touch screen
PC Software process logging, recipe transfer, etc.
User interface remote control over relay I/Os
Dimensions see layout
Weight 280 kg
Power supply 3 phase, country specific


Dual infrared heating
Dual infrared heating
Easy maintenance
Easy maintenance
Smart thermo regulator
Smart thermo regulator
Formic acid bubbler
Formic acid bubbler
Additional lamps cooling
Additional lamps cooling
Positive pressure
Positive pressure


Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors and high energy batteries, etc.

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