Programmable vacuum reflow soldering oven with heating area 100x100mm.


Vacuum pump

Product code: VSU12


Infrared lamps placed under the tooling plate heat it up. The tooling plate has a square form with dimensions 100x100mm and can be made of any suitable material. It can also be prefabricated with custom openings for fixtures inside it. Tooling plate can be replaced together with the parts on it. This enables serial production. Nitrogen flow blows from the chamber bottom against the tooling plate and thus cools it down. The chamber itself is air cooled.



Process environment nitrogen, formic acid
Maximum temperature 350°C
Heating area 100 x 100 mm
Heating plate removable: graphite, aluminum, etc.
Clearance above heating plate 35 mm
Heat up / cool down ramp 120-150°C/min
Control deviation +/- 0.5°C
Heating elements 4x infrared heating lamps
Heating control common for all heaters
Cooling of heating plate nitrogen flow
Temperature measurement 1x fixed and 2x freely positional thermocouple K-Type
Pressure measurement integrated pressure transmitter
Maximum vacuum 5x10-2 mbar
Formic acid bubbler 40 ml container, integrated in front panel
Cooling of chamber body air cooling
Lid viewing port 34 mm
Display 7" LCD with touch screen
PC Software process logging, recipe transfer, etc.
User interface remote control over relay I/Os
Dimensions 330 mm(W) x 300 mm(D) x 443 mm(H) with open lid
Weight 12 kg
Power supply 1 phase / 190-240V, 50/60 Hz


Compact design
Compact design
Formic acid bubbler
Formic acid bubbler
Single phase supply
Single phase supply
Air cooling
Air cooling


Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors and high energy batteries, etc.

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