VSU20
Programmable vacuum reflow soldering oven with heating area 200mm diameter.
Configuration
Product code: VSU20
Product price: USD 32002
Delivery time:
Overview
The vacuum reflow oven is equipped with a hot plate made of solid aluminum, coated with ceramics. Another water cooled plate is mounted beneath the hot plate. In time of cooling the cold plate is lifted up and pressed against the hot plate, thus cooling it quickly. This feature also enables cooling under vacuum.
Datasheets
Specifications
| Maximum temperature | 400°C |
| Heated area | ∅ 200 mm |
| Clearance above heater plate | 50 mm |
| Ramp heat up / cool down | 120-150°C/min |
| Control deviation | +/- 0.5°C |
| Heating / cooling type | resistive heating / lifting cold plate |
| Temperature measurement | 1x fixed and up to 3x freely positional thermocouples K-Type |
| Pressure measurement | integrated pressure transmitter |
| Maximum vacuum | 5x10-4 mbar |
| Formic acid bubbler | 40 ml container, integrated in front panel |
| Chamber cooling | water cooling with integrated chiller |
| Display | 7" LCD with touch screen |
| Dimensions | 550 mm(W) x 615 mm(D) x 400 mm(H) with closed lid |
| Weight | 35 kg |
| Power supply | 1 phase / 190-240V, 50/60 Hz |
Highlights
Compact design
Cost effective process
Cooling under vacuum
Integrated water chiller
Easy maintenance
Smart thermo regulator
Formic acid bubbler
Single phase supply
Applications
Heating in vacuum and inert gas,
Power semiconductors on heat sinks,
Flip chip reflow,
Melting of bumps,
High intensity LED attach,
Sealing of hermetic packages,
Photovoltaic cell assembly,
Die attach,
Sintering of printed copper films,
Assembly of hybrid circuits,
Encapsulation of flat packs,
MEMS and opto devices,
Automotive sensors, etc.
