Vacuum reflow solder oven with dual heating and pressure

The new VSU28 vacuum reflow solder oven with dual heating and pressure Invacu introduces vacuum soldering system based on VSU28 model with double heating capable to pressurize the chamber up to 4.5 bar absolute. The powerful heating enables fast ramps even with very heavy thermal load. The heating distributes the power and creates an unique temperature uniformity when placed on the bottom of the chamber and in the lid. 70mm clearance over the heating plate allows processing of higher substrates and fixtures. Positive pressure combined with vacuum gives the possibility of super void removal even when the solder area is extremely large. Air flow through the heating lamps also in the lid assists the chamber cooling process lowering the nitrogen consumption.

Posted on

INVACU Ltd.


Copyright © INVACU 2019