Vacuum Reflow Soldering Ovens

Programmable vacuum ovens for reflow soldering in controllable atmosphere

vsu28

Vacuum Reflow Oven

designed for production and R&D

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vacuum reflow oven

Vacuum Reflow Process

fluxless formic acid technology

void-free die attach

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vacuum reflow process

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1000 Kelvin per minute with VSU28-D

Log of 1000 Kelvin per minute with VSU28-D During our latest test of vacuum reflow solder unit VSU28-D we measured heating rates of up to 996 K/minute. We ran this test without software limitation on the ramp speed and in maximum power. In 118 seconds the chamber reached 800°C. The experiment is made in 100mbar vacuum with the standard blank graphite plate 260x210x4.5mm and 230V supply. This power test shows that the dual heating VSU28 can be used for rapid thermal annealing of substrates or in any other cases where fast heating is required.

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