Vacuum Reflow Soldering Ovens

Programmable vacuum ovens for reflow soldering in controllable atmosphere

vsu28

Vacuum Reflow Oven

designed for production and R&D

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vacuum reflow oven

Vacuum Reflow Process

fluxless formic acid technology

void-free die attach

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vacuum reflow process

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Oxygen analyzer

Oxygen concentration analyzer on VSU28 We announced our first vacuum reflow oven with control over the oxygen concentration. System is equipped with external oxygen analyzer that communicates with the standard user interface of VSU28 enabling stop and hold the reflow process until certain low concentration in the chamber is reached. Thus the reflow process can be run under guaranteed low levels of oxygen down to in ppm range resulting in excellent wetting between solder surfaces.

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